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Photonic Debonding Tool

PulseForge Inc.Request Info
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AUSTIN, Texas, May 2, 2023 — The PD300 SA Photonic Debonding Tool from PulseForge Inc. is a semi-automated system suitable for wafer- and panel-level packaging, delivering a clean wafer separation solution.

Designed to enable semiconductor advanced packaging for R&D and low-volume users, the tool utilizes a photonic debonding process. It leverages high-intensity pulses of light in conjunction with reusable, light-absorbing layer carriers to debond temporarily bonded materials for wafer thinning, hybrid bonding, and micro-LED transfer. The tool can debond warped wafers without expensive warpage adjustment hardware or process changes.
May 2023

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ProductsPD300 SAPhotonic Debonding ToolPulseForgeWafersR&Dlight sourcesAmericas

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